1. Components, packaging and manufacturing technology :
Author: edited by Yanwen Wu.
Library: Center and Library of Islamic Studies in European Languages (Qom)
Subject: Electronic apparatus and appliances, Congresses.,Electronic packaging, Congresses.,Manufacturing processes, Congresses.,Microelectronic packaging, Congresses.
2. Sport materials, modelling and simulation
Author:
Library: Library of Campus2 Colleges of Engineering of Tehran University (Tehran)
Subject: Engineering,Athletics--Equipment and supplies--Design and construction,Computer simulation,Materials science
Classification :
TA
5
.
I52
2011
